The Interactive Butterfly Map: Multi-Tier Supply Chains & Second-Order Bottlenecks
“Who else gets paid, squeezed, or left behind if this happens?” Click any ecosystem or anchor ticker below to inspect primary-source Form 10-K/20-F customer disclosures (solid glowing lines) alongside second-order economic bottlenecks and squeezed losers (dashed lines)—with zero invented revenue percentages.
AAPL (Apple Inc.) — 1st & 2nd Order Supply-Chain Ripple Map
⚡ RANKED SECOND-ORDER POWER, NETWORKING & THERMAL SUPPLIERS (WITH LIVE RQD DELTAS)
Primary Hub: AAPL (Apple Inc. • Hub RQD 62/100) — Ranking connected 2nd-order & 3rd-order power, switchgear, liquid cooling, optical networking, lithography & HBM suppliers by RQD quality delta vs. hub.
| Rank | Supplier Node | Order & Bottleneck Role | Supplier RQD | RQD Delta vs AAPL (RQD 62) | Actions |
|---|---|---|---|---|---|
| #1 | QCOM2ND-ORDER QUALCOMM Incorporated | 5G RF Modem-to-Antenna Subsystems & Edge NPU Silicon Baseband modem and RF front-end transceiver architecture for flagship mobile ecosystems. | RQD 86(A) | +24 vs AAPL • Higher Quality | |
| #2 | TSM2ND-ORDER Taiwan Semiconductor Manufacturing Company Ltd. | 3nm/4nm Foundry Wafer Fab & CoWoS-L Advanced Packaging Sole-source wafer lithography and interposer packaging bottleneck for flagship AI accelerators. | RQD 69(C+) | +7 vs AAPL • Higher Quality | |
| #3 | ASML3RD-ORDER ASML Holding N.V. New York Registry Shares | High-NA EUV Lithography Scanners (Sub-2nm Node Gatekeeper) Upstream monopoly supplier of EUV lithography systems enabling all leading-edge foundry capacity. | RQD 68(C+) | +6 vs AAPL • Higher Quality | |
| #4 | KLAC3RD-ORDER KLA Corporation | Wafer Metrology, Mask Inspection & CoWoS Yield Control Process-control inspection equipment critical to 3nm die yield and advanced packaging economics. | RQD 68(C+) | +6 vs AAPL • Higher Quality | |
| #5 | AMAT3RD-ORDER Applied Materials Inc. | Gate-All-Around Deposition & Backside Power Delivery Tools Materials engineering and TSV etch equipment used across HBM memory and logic fabs. | RQD 67(C+) | +5 vs AAPL • Higher Quality | |
| #6 | MU2ND-ORDER Micron Technology Inc. | HBM3e / HBM4 High-Bandwidth Memory Stacks High-stack DRAM cube memory integrated directly onto CoWoS interposers alongside GPU dies. | RQD 66(C+) | +4 vs AAPL • Higher Quality | |
| #7 | VRT2ND-ORDER Vertiv Holdings LLC | Thermal & Liquid Cooling / Direct-to-Chip CDU Manifolds 120kW–140kW rack thermal dissipation requires chilled-water CDUs & rear-door heat exchangers. | RQD 65(C) | +3 vs AAPL • Higher Quality | |
| #8 | ARM3RD-ORDER Arm Holdings plc | v9 CPU Instruction Set Architecture & Neoverse Cloud Cores Royalty-bearing compute architecture underneath Apple Silicon, Grace CPUs, and custom cloud chips. | RQD 58(D+) | -4 vs AAPL • Torque Beta | |
| #9 | ON2ND-ORDER ON Semiconductor Corporation | Silicon Carbide (SiC) Traction Inverters & Power Trench MOSFETs High-voltage SiC power conversion modules extending EV range and data-center PSU efficiency. | RQD 54(D+) | -8 vs AAPL • Torque Beta |
Synchronized Transmission Matrix (9 Connections)
CLICK ANY ROW TO INSPECT PRIMARY FILING EVIDENCE →| Chain (Source → Target) | Relationship | Evidence Tier | Effect | Materiality / Disclosed Share |
|---|---|---|---|---|
| TSM→AAPL | CONFIRMED CUSTOMER | ✓ CONFIRMED FILING | TAILWIND | ~22%–25% Disclosed Largest Single Customer ("Customer A" in TSMC Form 20-F Note 35) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2025-04-18) |
| TSM→AMD | DIRECT SUPPLIER | ✓ CONFIRMED FILING | TAILWIND | Undisclosed % — Primary Advanced Logic Wafer & CoWoS Foundry Dependency (AMD Form 10-K) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2025-02-05) |
| LRCX→TSM | BOTTLENECK BENEFICIARY | ✓ CONFIRMED FILING | TAILWIND | 10%+ Disclosed Top Foundry/Memory Customer Tier (Lam Research Form 10-K Note 19) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2024-08-22) |
| KLAC→TSM | BOTTLENECK BENEFICIARY | ✓ CONFIRMED FILING | TAILWIND | >10% Disclosed Named Customer Concentration (KLA Corp. FY2024 Form 10-K Note 19) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2024-08-09) |
| TSM→AVGO | DIRECT SUPPLIER | ✓ CONFIRMED FILING | TAILWIND | ~90%+ of Broadcom Wafer Foundry Volume Disclosed at TSMC (Broadcom FY2024 Form 10-K Item 1) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2024-12-20) |
| ASML→TSM | DIRECT SUPPLIER | ✓ CONFIRMED FILING | TAILWIND | ~30%+ Disclosed Top Two Customer Concentration Tier (ASML FY2024 Form 20-F Note 21) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2025-03-05) |
| AMAT→TSM | DIRECT SUPPLIER | ✓ CONFIRMED FILING | TAILWIND | 10%+ Disclosed Major Foundry Customer Concentration (Applied Materials Form 10-K Note 18) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2024-12-13) |
| TSM→INTC | SUBSTITUTE / RIVAL | ✓ CONFIRMED FILING | MIXED / CONSTRAINT | Undisclosed % — Disclosed External Wafer Outsourcing & Competing Foundry Strategy (INTC Form 10-K) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2025-01-31) |
| TSM→NVDA | DIRECT SUPPLIER | ✓ CONFIRMED FILING | TAILWIND | Undisclosed Bilateral % — Primary Advanced Foundry & CoWoS Packaging Supplier (NVDA Form 10-K) • Verified via Annual SEC 10-K/20-F Relationship Disclosure (2025-02-26) |
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